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9um 12um 18um 35um High Density FPC PCB Copper Foil

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9um 12um 18um 35um High Density FPC PCB Copper Foil

Brand Name : OEM

Certification : ISO / SGS / RoHS

Place of Origin : China

MOQ : 50kg

Price : Negotiable

Payment Terms : L/C, T/T

Supply Ability : 550T Per Month

Delivery Time : 10 - 15 Days

Packaging Details : Exporting Wooden Case

Product Name : Single Shiny ED Red Copper Foil For FPC , Maximum Width 600mm

Alloy Number : C11000

Material : Red Copper

Shape : Roll

Density : 8.9g/cm3

Thickness : 1/4OZ~1OZ(9μm~35μm)

Width : 250mm~1295mm

Application : FPC

HS Code : 7410110000

Degraded rate of HCΦ(18%-1hr/25℃) : ≤7.0%

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9um 12um 18um 35um High Density FPC PCB Copper Foil

Specification:

Thickness: 9µm～35µm

Performances:

The product surface is black or red, has lower surface roughness.

Applications:

Flexible Copper Clad Laminate (FCCL), Fine Circuit FPC, LED coated crystal thin film.

Features:

High density, high bending resistance and good etching performance.

Microstructure:

9um 12um 18um 35um High Density FPC PCB Copper Foil

Table1- Performance:

Classification		Unit	9μm	12μm	18μm	35μm
Cu Content		%	≥99.8
Area Weigth		g/m2	80±3	107±3	153±5	283±7
Tensile Strength	R.T.(23℃)	Kg/mm2	≥28
	H.T.(180℃)		≥15	≥15	≥15	≥18
Elongation	R.T.(23℃)	%	≥5.0	≥5.0	≥6.0	≥10
	H.T.(180℃)		≥6.0	≥6.0	≥8.0	≥8.0
Roughness	Shiny(Ra)	μm	≤0.43
	Matte(Rz)		≤2.5
Peel Strength	R.T.(23℃)	Kg/cm	≥0.77	≥0.8	≥0.8	≥0.8
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤7.0
Change of color(E-1.0hr/200℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Appearance(Spot and copper powder)		----	None
Pinhole		EA	Zero
Size Tolerance	Width	mm	0~2mm
	Length	mm	----
Core		Mm/inch	Inside Diameter 79mm/3 inch

9um 12um 18um 35um High Density FPC PCB Copper Foil

Why Choose us Civen as your supplier?

1. Very competitive price
2. Small order acceptable
3. Good quality
4. On time delivery and perfect service
5. Customers' design are welcome!

Product Tags:

35um PCB Copper Foil

18um PCB Copper Foil

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