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CCL Thickness 9 Micron Red PCB Copper Foil

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CCL Thickness 9 Micron Red PCB Copper Foil

Brand Name : OEM

Certification : ISO / SGS / RoHS

Place of Origin : China

MOQ : 50kg

Price : Negotiable

Payment Terms : L/C, T/T

Delivery Time : 10 - 15 Days

Packaging Details : Exporting Wooden Case

Supply Ability : 550T Per Month

Alloy Number : C11000

Material : Red Copper

Shape : Roll Size

Thickness : 1/4OZ~20OZ(9μm~70μm)

Width : 550mm~1295mm

Density : 8.9g/cm3

Application : CCL,PCB

HS Code : 7410110000

Grade : Pure Copper

Alloy or not : Non-alloy

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CCL Thickness 9 Micron Red PCB Copper Foil

Description:

CCL/PCB electrolytic copper foil are classified as :Standard electrolytic copper foil(STD),High-temperture elongation of the copper foil( HTE) ,ultra-low contour copper foil(VLP), flexible copper foil(FCF),inversion of opper foil(RTF).Ordinary thickness of the ED copper foils are 9 microns and 12 microns ,18 microns,35 microns etc. The maximum width of the ED copper foil iw 1370mm(53.93inch),.Also we can do special process according to customer requirements .

Feature

. High temperature anti-oxidization performance.

. High temperature elongation performance.

. Environment friendly production.

Specification:

Classification		Unit	1/4OZ (9μm)	1/3OZ (12μm)	J OZ (15μm)	1/2OZ (18μm)	1OZ (35μm)	2OZ (70μm)
Cu Content		%	≥99.8
Area Weigth		g/m2	80±3	107±3	127±4	153±5	283±5	585±10
Tensile Strength	R.T.(25℃)	Kg/mm2	≥28	≥30
	H.T.(180℃)		≥15
Elongation	R.T.(25℃)	%	≥4.0	≥5.0	≥6.0		≥10
	H.T.(180℃)		≥4.0		≥5.0	≥6.0
Roughness	Shiny(Ra)	μm	≤0.4
	Matte(Rz)		≤5.0	≤6.0	≤7.0	≤7.0	≤9.0	≤14
Peel Strength	R.T.(23℃)	Kg/cm	≥1.0	≥1.2	≥1.2	≥1.3	≥1.8	≥2.0
Degraded rate of HCΦ(18%-1hr/25℃)		%	≤5.0
Change of color(E-1.0hr/190℃)		%	Good
Solder Floating 290℃		Sec.	≥20
Pinhole		EA	Zero
Preperg		----	FR-4

CCL Thickness 9 Micron Red PCB Copper Foil

Product Tags:

18 micron PCB Copper Foil

9 Micron Red PCB Copper Foil

35 micron PCB Copper Foil

CCL Thickness 9 Micron Red PCB Copper Foil Images

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